JPS60261163A - リードフレームの製造方法 - Google Patents

リードフレームの製造方法

Info

Publication number
JPS60261163A
JPS60261163A JP11731584A JP11731584A JPS60261163A JP S60261163 A JPS60261163 A JP S60261163A JP 11731584 A JP11731584 A JP 11731584A JP 11731584 A JP11731584 A JP 11731584A JP S60261163 A JPS60261163 A JP S60261163A
Authority
JP
Japan
Prior art keywords
lead frame
lead
sealed
resin
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11731584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0137853B2 (en]
Inventor
Mitsuharu Shimizu
清水　満晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP11731584A priority Critical patent/JPS60261163A/ja
Publication of JPS60261163A publication Critical patent/JPS60261163A/ja
Publication of JPH0137853B2 publication Critical patent/JPH0137853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP11731584A 1984-06-07 1984-06-07 リードフレームの製造方法 Granted JPS60261163A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11731584A JPS60261163A (ja) 1984-06-07 1984-06-07 リードフレームの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11731584A JPS60261163A (ja) 1984-06-07 1984-06-07 リードフレームの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63319001A Division JPH01215412A (ja) 1988-12-16 1988-12-16 プレス加工方法

Publications (2)

Publication Number Publication Date
JPS60261163A true JPS60261163A (ja) 1985-12-24
JPH0137853B2 JPH0137853B2 (en]) 1989-08-09

Family

ID=14708705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11731584A Granted JPS60261163A (ja) 1984-06-07 1984-06-07 リードフレームの製造方法

Country Status (1)

Country Link
JP (1) JPS60261163A (en])

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62186555A (ja) * 1986-02-12 1987-08-14 Hitachi Cable Ltd プレス成形リードフレームの製造方法
JPS6333642U (en]) * 1986-08-19 1988-03-04
JPH0677374A (ja) * 1992-08-27 1994-03-18 Nec Corp 半導体装置用リードおよびその製造方法
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法
JP2005517533A (ja) * 2001-12-24 2005-06-16 ファン ドールネズ トランスミッシー ビー．ブイ． 工作物、金属プッシュ・ベルト、およびこれを製造するための方法および処理ツール
JP2012160517A (ja) * 2011-01-31 2012-08-23 Mitsubishi Electric Corp 半導体装置の製造方法
JP2016105506A (ja) * 2016-02-24 2016-06-09 シャープ株式会社 発光装置
US10367127B2 (en) 2016-03-31 2019-07-30 Nichia Corporation Lead frame including hanger lead, package, and light-emitting device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501658A (en]) * 1973-05-07 1975-01-09
JPS501649A (en]) * 1973-05-07 1975-01-09
JPS51150185A (en) * 1975-06-18 1976-12-23 Hirata Press Kogyo Kk Shearing processing
JPS5574013A (en) * 1978-11-28 1980-06-04 Tanaka Precious Metal Ind Electric contact band material and method of fabricating same
JPS55160449A (en) * 1979-05-31 1980-12-13 Toshiba Corp Semiconductor device
JPS60123047A (ja) * 1983-12-07 1985-07-01 Toshiba Corp 半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501658A (en]) * 1973-05-07 1975-01-09
JPS501649A (en]) * 1973-05-07 1975-01-09
JPS51150185A (en) * 1975-06-18 1976-12-23 Hirata Press Kogyo Kk Shearing processing
JPS5574013A (en) * 1978-11-28 1980-06-04 Tanaka Precious Metal Ind Electric contact band material and method of fabricating same
JPS55160449A (en) * 1979-05-31 1980-12-13 Toshiba Corp Semiconductor device
JPS60123047A (ja) * 1983-12-07 1985-07-01 Toshiba Corp 半導体装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62186555A (ja) * 1986-02-12 1987-08-14 Hitachi Cable Ltd プレス成形リードフレームの製造方法
JPS6333642U (en]) * 1986-08-19 1988-03-04
JPH0677374A (ja) * 1992-08-27 1994-03-18 Nec Corp 半導体装置用リードおよびその製造方法
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法
JP2005517533A (ja) * 2001-12-24 2005-06-16 ファン ドールネズ トランスミッシー ビー．ブイ． 工作物、金属プッシュ・ベルト、およびこれを製造するための方法および処理ツール
JP2012160517A (ja) * 2011-01-31 2012-08-23 Mitsubishi Electric Corp 半導体装置の製造方法
JP2016105506A (ja) * 2016-02-24 2016-06-09 シャープ株式会社 発光装置
US10367127B2 (en) 2016-03-31 2019-07-30 Nichia Corporation Lead frame including hanger lead, package, and light-emitting device
US10937666B2 (en) 2016-03-31 2021-03-02 Nichia Corporation Method for manufacturing lead frame including electrode and hanger lead, method for manufacturing package having lead frame, and method for manufacturing light-emitting device having package

Also Published As

Publication number Publication date
JPH0137853B2 (en]) 1989-08-09

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